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2/2024 EN

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SEZNAM INZERENTŮ

A

Almeto
AWOS

C

CADware
Certuma

D

DownStream Technologies

E

Elitronic
EverMAX

I

ICAPE Group

L

LAMIREL

M

MAROX

P

Papouch
PCB Connect AB
PRINTED

T

TELUX
Terinvest/AMPER

CONTENT

Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs

Custom-made photonic components

Evolved for more challenges: Rohde & Schwarz adds eight-channel R & S MXO 5 to next-generation oscilloscopes

Cutting edge Smart Connected Sensors platform for full-body motion tracking

Yamaha Robotics: New YRM10, next-generation compact high-speed modular mounter

KYOCERA AVX releases its first linear card-edge connectors with spring contacts

Next-generation multizone time-of-flight sensor from STMicroelectronics boosts ranging performance and power saving

Dedicated thermal camera packages suit every electronic testing need

Quectel unveils Wi-Fi 7 modules for next-generation connectivity

The ams OSRAM SFH 7018 enables improved quality of heart rate and blood oxygen measurements for wearables

NXP extends industry-first 28 nm RFCMOS radar one-chip family to enable ADAS architectures for software-defined vehicles

New standard of enhanced code security with the PIC18-Q24 family of MCUs

Keysight expands signal source analyser portfolio for wireless, radar, and high-speed digital applications

New automotive chips enable automakers to create smarter, safer vehicles

New LCD bias power ICs deliver high performance in display devices

High-performance MCUs enable graphics and voice / vision multi-modal AI applications

SIGLENT released a new product: SDS7000A series high resolution oscilloscope

ROHM’s New SBDs: Ideal for automotive LED headlamps and other high-speed switching applications

Moxa unveils new-generation x86 industrial computers to top up data connectivity at industrial edge

New eBook offers expert perspectives on Internet of Things

Events calendar 2024